- For internal and external use (EN 204 D3)
- Water resistant
- Transparent when dry
For water-resistent (D3) joining and laminating of practically all soft, hard and exotic types of wood. Suitable for well-fitting, non-load bearing wooden structures using various wood joints such as finger joints, dovetail joints, mortise and tenon joints, dowels and springs. Suitable for indoor and outdoor applications (outdoor areas not exposed to weather influences), such as windows, doors and furniture in, for example, living rooms, offices, kitchens and bathrooms. For surface bonding wood, hard and softboard, chipboard, multiplex plywood, MDF, paper, cardboard and hardboard. Also suitable for laminating veneer and hard plastic sheet (HPL, Formica, Duropal, Resopal) on a wooden surface. D3: Interior spaces in which passing water, condensation and / or heavy stress due to increased relative humidity occurs frequently for a short time. Exteriors not exposed to weather influences.
The ambient temperature, the adhesive and the materials to be bonded should not be less than +5°C. Relative humidity of up to 65%. Level of wood humidity between 8% and 12%.
Surfaces must be clean, dust and grease-free and a good fit.
Preliminary surface treatment
Degrease oily types of wood with an appropriate cleaner.
Fine-toothed adhesive spreader (1 mm), brush or roller, clamps or press.
Dilute only with water.
5-7 m²/kg, applied on both sides, depending on the nature of the materials.
Directions for use
Apply the adhesive thinly and evenly on one or both parts using a fine-toothed adhesive spreader (1 mm), brush or roller. Allow the adhesive to soak in for a couple of minutes. Assemble joint within 8 minutes then clamp or press.
Points of attention
Avoid corrosion on metal parts (e.g. pump or machinery components). Use only acid resistant components with mechanical processing.
Remove adhesive residues immediately with water. Dry adhesive residue can only be removed mechanically.
Store in properly sealed packaging in a dry place at between +10°C and +20°C.